Medical Device 1

From: Tech Company  Date:03-26  Hits:Belong to:Case
With the implementation of a series of national key engineering projects, the instrumentation industry is increasingly receiving government attention and support. This will make the market investment value of the instrumentation industry increasingly prominent.
Traditional mechanical processing methods (ordinary processing) are the same as precision and precision processing methods. With the adoption of new technologies, processes, equipment, testing techniques, and instruments, the machining accuracy is constantly improving. The continuous improvement of machining accuracy reflects the development trend of material segmentation level from macro to micro world when machining workpieces. As time progresses, machining precision that was previously thought difficult to achieve will become relatively easy. So, ordinary machining, precision machining, and precision machining are just relative concepts? The boundaries between them constantly change over time. The typical representative of precision cutting and precision machining is diamond cutting. Taking diamond cutting as an example. The radius of the blade edge arc has been developing in a smaller direction. Because its size directly affects the roughness of the processed surface and is directly related to the reflectivity of the optical mirror, the reflectivity requirements for instruments and equipment are becoming increasingly high. If the reflectivity of the laser gyro reflector has been proposed to reach 99.99%, it inevitably requires sharper diamond cutting tools. In order to conduct thinning tests, the goal is to achieve a chip thickness of nm, and the radius of the tool edge arc should approach 2.4nm. In order to achieve this height, the traditional structure of the diamond grinder was changed. The main shaft bearing adopts air bearings as support, and the end face runout of the grinding disc can be self corrected on the machine tool, so that its end face runout is controlled at 0.5& Below mu; m.

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